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2024-08-08
Research on Gold Wire Ball Bonding Technology Based on Thick Film Circuit
Thick film circuits, as the core connection carrier of micro assembly, provide a mounting surface for bare chips and achieve electrical connection between the bare chip and the printed gold layer. This article explores the important process parameters of gold wire ball bonding technology using thick film circuits as supporting substrates, such as pressure, ultrasonic power, ultrasonic time, and temperature, which affect the bonding tensile strength, And obtain the variation curve of the influence between process parameters and bonding tensile strength, as well as the magnitude of the influence between different process parameters. At the same time, combined with the appearance of solder joints under different bonding parameter energies, further elaborate on the influence of process parameters on the reliability of solder joints