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2024-08-24
Research on Improving the Reliability of Wire Bonding
The methods of wire bonding and the quality control points of various bonding methods are evaluated through tensile failure tests to assess the existing bonding ability. As the working frequency of microwave products increases, the stability problem of wire bonding becomes more prominent. In response to these situations, the process parameters of substrate chemical plating are obtained through orthogonal tests to reduce the impact of the gold layer on the wire bonding strength and improve the wire bonding strength